Publication | Closed Access
Thermal Stress and Strain in Microelectronics Packaging
175
Citations
0
References
1993
Year
Materials ScienceThermal StressChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip AttachmentSolid MechanicsElectronic PackagingMicroelectronicsThermal EngineeringMechanics Of Materials
No additional data available for this publication yet. Check back later!