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Electronic structure and thermal stability of nitrided Hf silicate films using a direct N plasma
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Citations
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References
2006
Year
EngineeringSolid-state ChemistryChemistryNitrided Xhfo2Electronic StructurePlasma ProcessingPlasma ElectronicsNonthermal PlasmaThermal StabilityThin Film ProcessingMaterials ScienceCrystalline DefectsNanotechnologySilicate FilmOxide ElectronicsMaterial AnalysisDirect N PlasmaSurface ScienceApplied PhysicsThin FilmsPlasma ApplicationChemical Vapor Deposition
The thermal stability and electronic structure of nitrided xHfO2(100−x)SiO2 (HfSiO) (x=30%, 55%, and 70%), prepared using a direct N plasma treatment, were investigated. N 1s spectra of nitrided Hf silicate films indicate that complex chemical states are generated. In particular, energy states with a high binding energy are stable, even after a postnitridation annealing. The quantity of N incorporated into the film is not dependent on the mole fraction of HfO2 in the film, while the thermal stability of the N in the film is significantly influenced by the fraction of HfO2 present. The thermal stability of the N in the film critically affects the composition and thickness of the film: i.e., after the postnitridation annealing, the thickness of the silicate film and the quantity of Hf and N are decreased, as the result of the dissociation of unstable Hf–N bonds.
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