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Impact of annealing, surface/strain energy and linewidth to line spacing ratio on texture evolution in damascene Cu interconnects

Materials EngineeringMaterials ScienceElectromigration Technique3D Ic ArchitectureDamascene Cu InterconnectsEngineeringAdvanced Packaging (Semiconductors)Surface ScienceApplied PhysicsElectronic PackagingMicroelectronicsTexture EvolutionInterface PropertyInterconnect (Integrated Circuits)