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Resistive Switching Performance Improvement of ${\rm Ta}_{2}{\rm O}_{5-x}/{\rm TaO}_{y}$ Bilayer ReRAM Devices by Inserting ${\rm AlO}_{\delta}$ Barrier Layer
61
Citations
8
References
2013
Year
EngineeringEmerging Memory TechnologySemiconductor Device\Rm TaoHigh Voltage EngineeringPulse PowerMaterials EngineeringSemiconductor TechnologyElectrical EngineeringProgramming MeasurementsPhysicsBarrier LayerOxide ElectronicsSemiconductor MaterialMicroelectronicsMultilevel States\Rm TaApplied PhysicsTriple-layer Reram Devices
By inserting a thin AlO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">δ</sub> barrier layer between the electrode and tantalum oxide resistive switching layer, the triple-layer ReRAM devices with improved resistive switching performance are demonstrated. Pulsed programming measurements without external current compliance show 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup> cycle endurance without performance degradation. The ON/OFF ratio exceeds 1000. Low operation current is achieved using a smaller SET compliance current. Multilevel states are obtained through adjusting SET and RESET conditions, and retention longer than 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sup> s at 125°C is reported.
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