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Buckling of thermally-grown SiO<sub>2</sub>thin films
21
Citations
1
References
1972
Year
Materials ScienceEngineeringCrystalline DefectsPhysicsSi WafersApplied PhysicsStable FilmsSemiconductor MaterialUnsupported WindowsSemiconductor Device FabricationThin Film Process TechnologyThin FilmsThin Film Processing
The difference in thermal expansion causes compression in SiO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> thermally grown on Si wafers. Unsupported windows of SiO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> buckle if the oxide thickness/window width ratio (t/w) is too small. This correspondence presents the experimentally determined t/w ratio for stable films.
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