DESIGN CONSIDERATIONS FOR MEMS-SCALE PIEZOELECTRIC MECHANICAL VIBRATION ENERGY HARVESTERS

TLDR

Let's gather content. Background: lines with [Background, Purpose] and [Background]. So content: - "ABSTRACT Design considerations for piezoelectric-based energy harvesters for MEMS-scale sensors are presented, including a review of past work." - "Harvested ambient vibration energy can satisfy power needs of advanced MEMS-scale autonomous sensors for numerous applications, e.g., structural health monitoring." Purpose: lines with [Background, Purpose] and [Purpose, Mechanism]. So content: - same first line: "ABSTRACT Design considerations for piezoelectric-based energy harvesters for MEMS-scale sensors are presented, including a review of past work." - second: "Coupled 1-D and modal (beam structure) electromechanical models are presented to predict performance, especially power, from measured low-level ambient vibration sources." Mechanism: many lines.

Abstract

ABSTRACT Design considerations for piezoelectric-based energy harvesters for MEMS-scale sensors are presented, including a review of past work. Harvested ambient vibration energy can satisfy power needs of advanced MEMS-scale autonomous sensors for numerous applications, e.g., structural health monitoring. Coupled 1-D and modal (beam structure) electromechanical models are presented to predict performance, especially power, from measured low-level ambient vibration sources. Models are validated by comparison to prior published results and tests of a MEMS-scale device. A non-optimized prototype low-level ambient MEMS harvester producing 30 μW/cm3 is designed and modeled. A MEMS fabrication process for the prototype device is presented based on past work. Keywords: Energy scavengingpower harvestingMEMSpiezoelectricvibration energy conversionwireless sensors ACKNOWLEDGMENTS The authors would like to gratefully acknowledge contributions from John Dugundji, Professor Emeritus, Department of Aeronautics and Astronautics, MIT, Cambridge, MA. Notes †Device size does not include power electronics. This parameter is oftentimes not documented, but in some cases an estimate of the volume can be made. *ES is electrostatic, EM is electromagnetic, and P is piezoelectric. †Device volume is approximated as L × b × (2tip displacement + thickness). †Device volume is approximated as (L + L0) × (b0) × (2maximum tip displacement + H0).