Formation of self-aligned CoSi2 on selective epitaxial growth silicon layer on (001)Si inside 0.1–0.6 μm oxide openings prepared by electron beam lithography

Abstract

The self-aligned formation of CoSi2 was achieved on the selective epitaxial growth (SEG) silicon layer on (001)Si inside 0.1–0.6 μm oxide openings prepared by electron beam lithography. The uniform, high quality SEG Si layer was grown by ultrahigh vacuum chemical vapor deposition at 560 °C with Si2H6. Self-aligned CoSi2 film without lateral growth of silicide was grown on the SEG Si layer by rapid thermal annealing at 700 °C in N2 ambient. The successful integration of the self-aligned CoSi2 and SEG of Si processes promises to be a viable process technology for the future deep submicron devices.