Novel Cu–RuNx composite layer with good solderability and very low consumption rate - Concepedia

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Novel Cu–RuNx composite layer with good solderability and very low consumption rate

12

Citations

9

References

2010

Year

H. Y. Chuang, Cherng‐Yuan Lin, Jinn P. Chu, C. R. Kao

Journal of Alloys and Compounds

Materials EngineeringMaterials ScienceGood SolderabilityEngineeringNanomaterialsMechanical EngineeringHigh-performance MaterialLow Consumption Rate

References

	Year	Citations

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