Investigation of the delamination mechanism of the thin film dielectric structure in flip chip packages - Concepedia

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Investigation of the delamination mechanism of the thin film dielectric structure in flip chip packages

10

Citations

9

References

2009

Year

C.C. Chiu, Chih-Ming Huang, Shao‐Yu Yang, Chang‐Chun Lee, Kuo‐Ning Chiang

Microelectronic Engineering

Materials ScienceElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On BoardApplied PhysicsChip AttachmentElectronic PackagingMicroelectronicsFlip Chip PackagesDelamination MechanismElectrical Insulation

References

	Year	Citations

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