Publication | Closed Access
Study on the thermoforming of PC films used for in-mold decoration
55
Citations
3
References
2008
Year
Materials ScienceEngineeringMicrofabricationPolymer ScienceApplied PhysicsThermal PropertyIn-mold DecorationThermal AnalysisThermodynamicsThermal ConductionElectronic PackagingHeat TransferThermal EngineeringPc FilmsThermal InsulationThermoanalytical Method
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