Publication | Closed Access
Optimization and Comparative Study on Oblique- and Rectangular-Fin Microchannel Heat Sinks
26
Citations
7
References
2010
Year
Microchannels PHeat Transfer ProcessEngineeringHeat SinkLiquid Metal CoolingMicrofabricationThermal HydraulicsHeat Transfer EnhancementMechanical EngineeringHeat ExchangerThermal ModelingThermodynamicsHeat TransferBase SubstrateHeat PipeThermal EngineeringComparative Study
Nomenclature Ac = cross-sectional area of microchannels, m 2 As = surface area of the base substrate, m 2 Hc = depth of microchannels, 0.0004 m Lf = length of fin, m Lg = length of gap, m Lx = length of the heat sink, 0.01 m Ly = width of the heat sink, 0.01 m Lz = height of the heat sink, 0.0005 m _ m = mass flow rate, kg=s n = number of microchannels P = pumping power, W pc = pitch of channel, m px = pitch of fins in x direction, m q = heat flux, 1:0e6 W=m Rth = thermal resistance, K=W T = temperature, K uavg = average coolant velocity in microchannels, m=s Wb = thickness of substrate, 0.0001 m Wc = width of microchannels, m Wf = width of fins, m x, y, z = orthogonal coordinate system = design variable pc=Hc = design variableWf=pc = design variable Lf=px p = pressure drop, Pa = oblique angle
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