Publication | Closed Access
ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness
27
Citations
7
References
2011
Year
Device Modeling3D Ic ArchitectureElectrical EngineeringEngineeringPower Mosfets RobustnessBias Temperature InstabilityElectro-thermal SimulationsModeling And SimulationThermal ModelingElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringPower ElectronicsCircuit Simulation
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