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Impact of Deionized Water Rinses on Silicon Surface Cleaning
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1982
Year
Self-cleaning SurfaceChemical EngineeringWafer Scale ProcessingEngineeringEnvironmental EngineeringCleaning EfficiencySurface ScienceWater PurificationWater TreatmentSilicon Surface CleaningIntegrated CircuitsDisinfectantSurface TreatmentMonitor MethodOxide RemovalSilicon On InsulatorSurface Processing
The 64Cu monitor method was used to study the impact of rinses on the cleaning efficiency of fluorinated silicon surfaces. Omission of the rinse between oxide removal by vapor and the cleaning solution immersion improves the cleaning efficiencies considerably on p‐doped and slightly on n‐doped silicon wafers in comparison to the identical process with a rinse.