Applied Physics Letters · 1998 · 32 citations · 4 references
Natural SciencesMaterials EngineeringMaterials ScienceInterface ScienceSurface ChemistrySurface ScienceChemical BondingInterface EngineeringPolymer SurfacesPolymer Thin FilmsSurface PhysicsThin Film AdhesionAdhesion MechanismsInterfacial AdhesionInterfacial PropertiesMetallizationPlasma-assisted BondingPolymer Film AdhesionPolymer Surface ChemistryPolymer Thin Film Interfaces
In this letter, we study Ta/parylene-F (PA–F) buried interfaces using x-ray photoelectron spectroscopy. We found that the Ta–F bond was formed at the Ta/PA–F interface after depositing a layer of thin Ta film (<50 Å). For the Ar+ or O2 plasma pretreated PA–F surface, in addition to the Ta–F bond, a Ta–C bond was observed at the buried interface after Ta metallization. The Ta–C bond may be responsible for the enhancement of Ta/PA–F adhesion.
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Interaction of amorphous fluoropolymer with metal
Peter Wu, G.‐R. Yang, X. F. et al. · Applied Physics Letters · 1994 · 39 citations
Natural Sciences, Materials Engineering, Materials Science +17