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Chemical interactions at Ta/fluorinated polymer buried interfaces
32
Citations
4
References
1998
Year
EngineeringTa MetallizationChemistryTa–f BondChemical InteractionsInterface ChemistryPolymer ChemistryMaterials ScienceBuried InterfaceInterface PropertySurface CharacterizationElectronic MaterialsSurface ChemistrySurface AnalysisPolymer ScienceApplied PhysicsSurface ScienceThin FilmsInterface StructureInterface Phenomenon
In this letter, we study Ta/parylene-F (PA–F) buried interfaces using x-ray photoelectron spectroscopy. We found that the Ta–F bond was formed at the Ta/PA–F interface after depositing a layer of thin Ta film (<50 Å). For the Ar+ or O2 plasma pretreated PA–F surface, in addition to the Ta–F bond, a Ta–C bond was observed at the buried interface after Ta metallization. The Ta–C bond may be responsible for the enhancement of Ta/PA–F adhesion.
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