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Commercialization of Honeywell's VCSEL technology: further developments
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2001
Year
Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Hardware ReliabilityEnergy EfficiencyNanoelectronicsVcsel TechnologyProton-implanted VcselsApplied PhysicsDevice IntegrationOxide-confined DevicesEnergy EngineeringElectronic PackagingDevice ReliabilityMicroelectronicsOptoelectronicsMore Vcsel Technologies
Each year, more VCSEL technologies make the transition from research curiosities to commercially available products. In this paper we describe several such technologies at Honeywell, each at a different stage of that transition. Oxide-confined devices are already past the transition stage. We describe the generally excellent reliability of oxide-confined devices already in high-volume production, and compare it to results of the most recent-and possibly last-long-term reliability study of proton-implanted VCSELs. We report on detailed package-VCSEL interaction modeling, which is being used to improve performance and extend the life of common form-factor packages. We also note Honeywell's progress toward commercialization of VCSELs and allied products at wavelengths other than 850 nm.