Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2001 · 33 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsOptoelectronicsSemiconductor DevicesChip PackagingDevice ReliabilityHigh-frequency Semiconductor DevicesOxide SemiconductorsSemiconductor Device MaterialsSemiconductor ReliabilityComplementary Metal-oxide-semiconductor DevicesLong-term Device ReliabilityOxide ReliabilityPackage ReliabilityPackage-level ReliabilityPackaging-induced ReliabilityReliability TestingVolume Production
Each year, more VCSEL technologies make the transition from research curiosities to commercially available products. In this paper we describe several such technologies at Honeywell, each at a different stage of that transition. Oxide-confined devices are already past the transition stage. We describe the generally excellent reliability of oxide-confined devices already in high-volume production, and compare it to results of the most recent-and possibly last-long-term reliability study of proton-implanted VCSELs. We report on detailed package-VCSEL interaction modeling, which is being used to improve performance and extend the life of common form-factor packages. We also note Honeywell's progress toward commercialization of VCSELs and allied products at wavelengths other than 850 nm.