Microelectronics International · 2009 · 10 citations · 9 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials ChemistrySemiconductor MaterialsAlloysElectrical ConductivityElectrode MaterialsMetal MaterialsMetalsSemiconductor Device MaterialsAmorphous AlloysAmorphous StructureNickel AlloysNickel-based AlloysResistivityResistorsStabilizationThermal Stabilization
Purpose The purpose of this paper is to characterize electrical parameters of amorphous Ni‐P resistive layers used for fabrication of precise resistors. Design/methodology/approach Ni‐P resistive layers were produced by the chemical process in water solution using Ni 2 + and H 2 PO 2 − ions. The paper presents the results of the studies concerning the influence of bath acidity and conditions of thermal stabilization on the structure and temperature coefficient of resistance of Ni‐P alloy. Findings The temperature coefficient of resistance of amorphous Ni‐P layers was found to depend significantly on the parameters of chemical metallisation process. It was stated that the changes of through‐casing resistivity versus the acidity of technological solution have roughly parabolic characteristics. Originality/value In this paper, it was at first explained how the changes of the structure of Ni‐P resistive layers depend on their temperature coefficient of capacitance.
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Study on the crystallization process of Ni P amorphous alloy
Hexing Li, Hai-Ying Chen, Shuzhong Dong et al. · Applied Surface Science · 1998 · 62 citations
Natural Sciences, Materials Engineering, Materials Science +14