Ultra-Compact Integration for Fully-Implantable Neural Microsystems

Abstract

A new approach to microsystem integration to replace conventional area-consuming platform architectures with an overlay integration cable is presented. A parylene cable carrying interconnect lines is used to integrate a 3-D array of silicon microelectrodes with a custom-designed signal conditioning chip to realize a neural recording microsystem in its most compact form. This low-profile integrated front-end was implanted in a guinea pig and used to obtain discriminable neural activity.