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Effects of current density and deposition time on electrical resistivity of electroplated Cu layers

Materials ScienceMaterials EngineeringElectrical EngineeringDeposition TimeEngineeringSpecific ResistanceElectromigration TechniqueCorrosionCurrent DensitySurface ScienceApplied PhysicsElectronic PackagingChemical DepositionMicroelectronicsElectrical PropertyElectrical ResistivityInterconnect (Integrated Circuits)Electrical Insulation