Applications of grain boundary diffusion studies to soldering and thermocompression bonding

Characterization of solid surfaces

G.W. Simmons · Journal of Colloid and Interface Science · 1975 · 275 citations

Materials Science, Geometric Modeling, Engineering +5

Low-temperature diffusion of copper through gold

Harland G. Tompkins, M. R. Pinnel · Journal of Applied Physics · 1976 · 83 citations

Materials Science, Chemical Engineering, Surface Film +12

Interdiffusion in the CuAu thin film system at 25°C to 250°C

P. M. Hall, J.M. Morabito, N. Panousis · Thin Solid Films · 1977 · 56 citations

Relative rates of nickel diffusion and copper diffusion through gold

Harland G. Tompkins, M. R. Pinnel · Journal of Applied Physics · 1977 · 56 citations · Full text

Materials Science, Engineering, Diffusion Resistance +12

A formalism for determining grain boundary diffusion coefficients using surface analysis

P. M. Hall, J.M. Morabito · Surface Science · 1976 · 44 citations

Engineering, Diffusion Resistance, Surface Analysis +6