Interdiffusion in the CuAu thin film system at 25°C to 250°C

<i>Electrical Resistance of Metals</i>

G. T. Meaden, L. I. Van Torne · Physics Today · 1966 · 462 citations

Natural Sciences, Materials Engineering, Materials Science +12

An X-Ray Method of Determining Rates of Diffusion in the Solid State

Jesse W. M. DuMond, J. Paul Youtz · Journal of Applied Physics · 1940 · 194 citations · Full text

Natural Sciences, Chemistry, Solid State Physics +2

The properties of electrodeposited metals and alloys

Gillian Siddall · Thin Solid Films · 1976 · 193 citations

Natural Sciences, Materials Engineering, Materials Science +12

Diffusion in Copper and Copper Alloys, Part II. Copper-Silver and Copper-Gold Systems

Daniel B. Butrymowicz, J. R. Manning, Michael Read · Journal of Physical and Chemical Reference Data · 1974 · 124 citations

Natural Sciences, Materials Engineering, Materials Science +17

Diffusion mechanisms in the Pd/Au thin film system and the correlation of resistivity changes with Auger electron spectroscopy and Rutherford backscattering profiles

P. M. Hall, J.M. Morabito, J. M. Poate · Thin Solid Films · 1976 · 108 citations

Natural Sciences, Materials Science, Physics +17