Controlled improvement in specific contact resistivity for thermoelectric materials by ion implantation

Abstract

To obtain reduced specific contact resistivity, iodine donors and silver acceptors were ion-implanted into n-type and p-type (Bi,Sb)2(Se,Te)3 materials, respectively, to achieve >10 times higher doping at the surface. Implantation into n-type materials caused the specific contact resistivity to decrease from 1.7 × 10−6 Ω cm2 to 4.5 × 10−7 Ω cm2. Implantation into p-type materials caused specific contact resistivity to decrease from 7.7 × 10−7 Ω cm2 to 2.7 × 10−7 Ω cm2. For implanted thin-film superlattices, the non-implanted values of 1.4 × 10−7 Ω cm2 and 5.3 × 10−8 Ω cm2 precipitously dropped below the detection limit after implantation, ≤10−8 Ω cm2. These reductions in specific contact resistivity are consistent with an increase in tunneling across the contact.