Evaluation of cluster tool throughput for thin film head production

Abstract

Article Free Access Share on Evaluation of cluster tool throughput for thin film head production Authors: Eric J. Koehler Wafer Systems Engineering, Seagate Technology, One Disc Drive, Bloomington, MN Wafer Systems Engineering, Seagate Technology, One Disc Drive, Bloomington, MNView Profile , Timbur M. Wulf Wafer Systems Engineering, Seagate Technology, One Disc Drive, Bloomington, MN Wafer Systems Engineering, Seagate Technology, One Disc Drive, Bloomington, MNView Profile , Alvin C. Bruska Wafer Systems Engineering, Seagate Technology, One Disc Drive, Bloomington, MN Wafer Systems Engineering, Seagate Technology, One Disc Drive, Bloomington, MNView Profile , Marvin S. Seppanen Production Systems of Winona, MN, 2225 Garvin Heights Road, Winona, MN Production Systems of Winona, MN, 2225 Garvin Heights Road, Winona, MNView Profile Authors Info & Claims WSC '99: Proceedings of the 31st conference on Winter simulation: Simulation---a bridge to the future - Volume 1December 1999 Pages 714–719https://doi.org/10.1145/324138.324465Published:01 December 1999Publication History 12citation169DownloadsMetricsTotal Citations12Total Downloads169Last 12 Months7Last 6 weeks4 Get Citation AlertsNew Citation Alert added!This alert has been successfully added and will be sent to:You will be notified whenever a record that you have chosen has been cited.To manage your alert preferences, click on the button below.Manage my AlertsNew Citation Alert!Please log in to your account Save to BinderSave to BinderCreate a New BinderNameCancelCreateExport CitationPublisher SiteeReaderPDF