Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

Advances in lead-free electronics soldering

Katsuaki Suganuma · Current Opinion in Solid State and Materials Science · 2001 · 721 citations

Materials Science, Electrical Engineering, Lead-free Electronics +6

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 353 citations

Materials Engineering, Materials Science, Materials Challenges +15

On the Sn-Bi-Ag ternary phase diagram

Ursula R. Kattner, W. J. Boettinger · Journal of Electronic Materials · 1994 · 183 citations

Engineering, Physics, Phase Equilibrium +3

Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints

Steffen Wiese, Andreas Schubert, H. Walter et al. · 2001 · 133 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Getting Ready for Lead‐free Solders*

N.‐C. Lee · Soldering and Surface Mount Technology · 1997 · 112 citations

Materials Science, Materials Engineering, Lead Conversion +13