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Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

Materials ScienceMaterials EngineeringLead-free Sn–ag–cu–biEngineeringSn60pb40 Solder InterconnectionsInterconnect (Integrated Circuits)Applied PhysicsFatigue BehaviorsElectronic PackagingLow-cycle FatigueMicrostructure