Publication | Open Access
Effect of Mechanical and Electrical Stresses on the Performance of an a-Si:H TFT on Plastic Substrate
45
Citations
7
References
2004
Year
Thin-film TransistorEngineeringMechanical EngineeringThin Film Process TechnologySilicon On InsulatorSemiconductor DeviceElectrical StressesElectronic DevicesWafer Scale ProcessingElectronic PackagingThin Film ProcessingMaterials SciencePlastic SubstrateElectrical EngineeringSemiconductor Device FabricationPlasticityH TftElectronic MaterialsMicrofabricationApplied PhysicsAmorphous SiliconThin FilmsAmorphous Solid
We studied the effect of mechanical and electrical stresses on the performance of an hydrogenated amorphous silicon (a-Si:H) thin-film transistor (TFT) adopting an organic layer as the first gate insulator on plastic. The TFT with the maximum deposition temperature of 150°C exhibited a field-effect mobility of 0.4 cm2/Vs and a threshold voltage of 1.5 V and the leakage current of less than The individual transistors were strained by inward (compression) or outward (tension) cylindrical bending with parallel to the source-drain current path. The TFT performance was approximately unchanged until the strain was ±1%. The mobility had a linear relationship with strain near the flat region, which appeared to be due to the change in the disorder by bending. The bias-stress effect on the TFT performance depended on the strain induced on the a-Si:H by mechanical bending. © 2004 The Electrochemical Society. All rights reserved.
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