Transient creep behaviour of hot isostatically pressed silicon nitride

A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials

R. L. Coble · Journal of Applied Physics · 1963 · 2.3K citations

Natural Sciences, Materials Engineering, Materials Science +15

On grain boundary sliding and diffusional creep

Rishi Raj, Michael F. Ashby · Metallurgical Transactions · 1971 · 1.3K citations

Natural Sciences, Materials Engineering, Materials Science +14

The growth of grain-boundary voids under stress

D. Hüll, D E Rimmer · Philosophical magazine · 1959 · 934 citations

Engineering, Materials Engineering, Materials Science +17

High strength materials

Alfred Seeger · Journal of the Franklin Institute · 1966 · 808 citations

Natural Sciences, Materials Engineering, Materials Science +17

Relationships between processing, microstructure and properties of dense and reaction-bonded silicon nitride

G. Ziegler, J. Heinrich, Gerhard Wtting · Journal of Materials Science · 1987 · 776 citations

Engineering, Materials Engineering, Materials Science +12