Solution Chemistry and Colloid Formation in the Tin Chloride Sensitizing Process

Richard L. Cohen, K. W. West

Journal of The Electrochemical Society · 1972 · 37 citations · 0 references

Concepts

Abstract

For many years, stannous chloride solutions have been used to prepare surfaces so that they would catalyze deposition from electroless plating solutions. This paper discusses the colloid and solution chemistry of such baths, including the colloid formation, size mediation, and aging processes. The colloid is shown to be nucleated by stannic ions, and mediated by stannous ions. The investigation was carried out primarily using Mössbauer spectroscopy to characterize the materials involved.