Concepedia

Mechanism for Cu void defect on various electroplated film conditions

Hsien‐Ping Feng, Min‐Yuan Cheng, Y.L. Wang, Y.L. Wang, Shih-Chieh Chang, Y.Y. Wang, Y.Y. Wang, C.C. Wan

Thin Solid Films · 2005 · 19 citations · 11 references

DOI

Concepts

References

11

Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings

John A. Thornton · Journal of Vacuum Science and Technology · 1975 · 436 citations

, , +17

Liner materials for direct electrodeposition of Cu

Michael Lane, Conal E. Murray, F. R. McFeely et al. · Applied Physics Letters · 2003 · 162 citations

, , +15

Effects of barrier layer and annealing on abnormal grain growth in copper thin films

E. M. Zielinski, Richard P. Vinci, J. C. Bravman · Journal of Applied Physics · 1994 · 132 citations

, , +17

Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films

Haebum Lee, S.S. Wong, S.D. Lopatin · Journal of Applied Physics · 2003 · 130 citations

, , +17

Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

Linda Vanasupa, Young‐Chang Joo, Paul R. Besser · Journal of Applied Physics · 1999 · 108 citations

, , +15