LTCC INTERCONNECT MODELING BY SUPPORT VECTOR REGRESSION

Abstract

In this paper, we introduce a new method: support vector regression (SVR) method to modeling low temperature co-fired ceramic (LTCC) multilayer interconnect. SVR bases on structural risk minimization (SRM) principle, which leads to good generalization ability. A LTCC based stripline-to-stripline interconnect used as example to verify the proposed method. Experiment results show that the developed SVR model perform a good predictive ability in analyzing the electrical performance.