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Redistribution of oxygen within damage regions of boron-implanted silicon
18
Citations
4
References
1981
Year
Materials ScienceMaterials EngineeringIon ImplantationEngineeringCrystalline DefectsOxide ElectronicsApplied PhysicsDamage RegionsSecondary-ion Mass SpectrometryDefect FormationSemiconductor Device FabricationSilicon On InsulatorSecondary AnnealingsMicrostructureResidual Damage Structure
The redistribution and gettering of 16O in Si within boron-implanted regions has been investigated using transmission electron microscopy and secondary-ion mass spectrometry profiling. It has been shown that low-temperature (⩽ 600 °C) secondary annealings following normal high-temperature (900–1000 °C) annealing result in the rapid diffusion and gettering of oxygen within residual damage regions. The gettered oxygen is present in the form of SiOx precipitates stabilized along dislocations lines and residual damage structure.
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