Manifold Design for Micro-Channel Cooling With Uniform Flow Distribution

Abstract

High-power electronic systems often require temperature uniformity for optimal performance. While many advanced cooling systems, such as micro-channels, result in significant heat removal, they are also susceptible to flow mal-distribution that can impact the local temperature variation on a device. By examining the pressure drops through each flow path in a multi-channel cooling system, an analytical model is predicted for the optimal manifold shape to produce uniform velocities. This is a simple power law, whose exponent depends on the flow regime in the manifold passages. The model is validated for laminar fully developed conditions using a series of computational simulations. With the power law design, the speeds in a parallel channel design are uniformly distributed at low Reynolds numbers, with a standard deviation of less than 3% of the overall mean channel speed. At higher Reynolds numbers, some mal-distribution is observed due to developing flow conditions, but it is not as significant as with typical untapered designs.