Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

Lange's handbook of chemistry

Choice Reviews Online · 1992 · 7.2K citations · Full text

Lange's handbook of chemistry

Choice Reviews Online · 2005 · 1.9K citations

Engineering, Handbook Of Chemistry, Natural Sciences +5

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Tomi Laurila, Vesa Vuorinen, Mervi Paulasto‐Kröckel · Materials Science and Engineering R Reports · 2010 · 330 citations

Materials Science, Materials Engineering, Engineering +11

Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

Kazuhiro Nogita · Intermetallics · 2009 · 187 citations

Materials Engineering, Materials Science, Engineering +7

Phase equilibria and solidification properties of Sn-Cu-Ni alloys

Chih‐Hao Lin, Sinn-wen Chen, Chao-hong Wang · Journal of Electronic Materials · 2002 · 162 citations

Materials Engineering, Materials Science, Engineering +6