Direct formation of conductor films by laser sublimating of ceramics

Abstract

A new method for direct formation of conductor lines onto ceramic substrates is presented. This method involves the selective forming of aluminum thin films by decomposing aluminum nitride (AlN) ceramics in argon (Ar) gas atmosphere with a Q-switched yttrium aluminum garnet (YAG) laser. The aluminum films can also be employed as a catalyst in electroless plating. With nickel (Ni) electroless plating solution, Ni conductor lines with a specific resistance about 1×10−7 Ω m were directly and selectively formed on the aluminum layer.