Organic additives in zinc electroplating

Double layer and electrode kinetics

Y. Okinaka · Journal of the Franklin Institute · 1965 · 494 citations

Natural Sciences, Chemistry, Materials Science +14

The Effect of Some Addition Agents on the Kinetics of Copper Electrodeposition from a Sulfate Solution

Dennis R. Turner, Glenn R. Johnson · Journal of The Electrochemical Society · 1962 · 146 citations

Natural Sciences, Chemistry, Materials Science +17

Modern Aspects of Electrochemistry

Roger Parsons · Journal of Electroanalytical Chemistry · 1985 · 83 citations

Natural Sciences, Chemical Engineering, Chemistry +12

An Investigation of the Mechanism of Levelling in Electrodeposition

S. A. Watson, John O. Edwards · Transactions of the IMF · 1956 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +11

Dislocations in a welded interface between two isotropic media

S. Nakahara, Jian Buo Wu, J.C.M Li · Materials Science and Engineering · 1972 · 55 citations

Natural Sciences, Materials Engineering, Materials Science +13