2009 · 29 citations · 19 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSystem-on-chip DesignDevice ModelingDigital Integrated Circuit DesignIntegrated Circuit DesignIntegrated Circuit DevicesInterconnect DesignInterconnect Technology3D Integrated CircuitsDensityInterconnect ModelingInterconnect OptimizationInterconnect ScalingThree-dimensional Integrated Circuit InterconnectsThree-dimensional Integrated Circuit LayoutThree-dimensional Integration
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits, we can greatly increase integration density, reduce inter-connection length, and enable heterogeneous systems within one package. In order to exploit the advantages of 3D in-tegration, layout designers and tool developers need to be fully aware of this rapid development. This paper gives an overview of recent 3D integration technologies, such as 3D packages and 3D integrated circuits. We then analyze and compare 3D data structures in order to draw conclusions about their future potential. Finally, the impact of 3D tech-nologies on interconnect prediction is discussed.
19
Demystifying 3D ICs: The Pros and Cons of Going Vertical
W. Rhett Davis, John Wilson, Stephen Mick et al. · IEEE Design & Test of Computers · 2005 · 832 citations
Engineering, Computer Engineering, Electrical Engineering +17
Three-dimensional integrated circuits
Anna W. Topol, Douglas Charles La Tulipe, D.J. Frank et al. · IBM Journal of Research and Development · 2006 · 701 citations
Engineering, Computer Engineering, Electrical Engineering +17
A thermal-driven floorplanning algorithm for 3D ICs