Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints

An x-ray diffraction and calorimetric investigation of the compound Cu6Sn5

A. Gangulee, G. C. Das, M. B. Bever · Metallurgical Transactions · 1973 · 154 citations

Natural Sciences, Materials Engineering, Materials Science +12

Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

Cheng–En Ho, Ruixiao Zheng, Gan Luo et al. · Journal of Electronic Materials · 2000 · 121 citations

Natural Sciences, Materials Engineering, Materials Science +16

Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging

Andrew M. Minor, J. W. Morris · Metallurgical and Materials Transactions A · 2000 · 84 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +11

Effect of magnetic transition on the lattice expansion of nickel

Mohammad Yousuf, P. Ch. Sahu, H K Jajoo et al. · Journal of Physics F Metal Physics · 1986 · 83 citations

Natural Sciences, Materials Science, Physics +17

Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

Cheng–En Ho, Y. M. Chen, C. R. Kao · Journal of Electronic Materials · 1999 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +16