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A low dark current InGaAs/InP p-i-n photodiode with covered mesa structure
36
Citations
16
References
1987
Year
Wide-bandgap SemiconductorOptical MaterialsEngineeringOptoelectronic DevicesImage SensorCovered MesaPhotoelectric SensorMolecular Beam EpitaxyCompound SemiconductorPhotonicsElectrical EngineeringOptoelectronic MaterialsNew Lighting TechnologyPhotoelectric MeasurementIngaas RegionCovered Mesa StructureApplied PhysicsIngaas LayerOptoelectronics
A new InGaAs p-i-n photodiode with a covered mesa (CM) structure having extremely low dark current characteristics and high yields has been developed. The device consists of only two epitaxial layers: n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-</sup> -InP and n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-</sup> -InGaAs, continuously grown on an n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> -InP substrate by liquid-phase epitaxy. The InGaAs layer is chemically etched to be a tapered shape in order to make the fabrication process simple, as compared with a conventional mesa diode. The Zn diffusion to form a p-n junction is carried out without a diffusion mask such as Si <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> N <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</inf> or SiO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> , which induces damage due to the thermal stress. The tapered-shape InGaAs layer is covered with the Zn-diffused layer because a surface p-n junction occurring in an InGaAs region is leaky. Therefore, the surface p-n junction of the photodiode appears in the n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-</sup> -InP layer, which has a bandgap about two times wider than the InGaAs. Finally, the passivation of the surface p-n junction is carried out with a Si <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> N <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</inf> film formed by a plasma-assisted chemical vapor deposition. We have successfully achieved an extremely low dark current of 20 pA at a reverse bias voltage of 10 V and a high yield of 80 percent, by adopting the CM structure and the simple fabrication process.
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