Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO<sub>2</sub>joint using an Ag<sub>68.8</sub>Cu<sub>26.7</sub>Ti<sub>4.5</sub>interlayer at 900 °C - Concepedia

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Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO<sub>2</sub>joint using an Ag<sub>68.8</sub>Cu<sub>26.7</sub>Ti<sub>4.5</sub>interlayer at 900 °C

26

Citations

32

References

2014

Year

Shen-Hung Wei, Chien-Cheng Lin

Journal of materials research/Pratt's guide to venture capital sources

Materials EngineeringMaterials ScienceEngineeringCeramic MaterialApplied PhysicsMicrostructural EvolutionAlloy PhaseMicrostructure

References

	Year	Citations

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