Applied Physics Letters · 1991 · 53 citations · 9 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials ChemistryPhysical ChemistryThin FilmsAluminum OxidesChemical Vapor DepositionSurface KineticsSurface PhysicsThin-film DepositionThin-film MaterialsActivation EnergyAtmospheric Pressure Chemical Vapor DepositionDiffusivityFilm ThicknessSticking ProbabilityTemperature DependenceTemperature Effects On DepositionThin-film Growth Kinetics
The sticking probability and molecular size of the growth species were determined as a function of deposition temperature ranging from 700 to 950 °C, in the AlN films prepared from AlCl3 and NH3. A novel method was developed, that includes the measurement of the film thickness profile on micron-sized trenches and the molecular diffusivity of the growth species. The molecular size was about 1 nm at 700–850 °C and decreased gradually with increasing temperature. The sticking probability increased from 0.02 to 0.5 in the temperature range 700–950 °C and, surprisingly, obeyed the Arrhenius law in spite of this large probability of sticking. The activation energy amounted to 136 kJ/mol.
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<i>The Properties of Gases and Liquids</i>
Robert C. Reid, T. K. Sherwood, Robert E. Street · Physics Today · 1959 · 14.2K citations
Natural Sciences, Chemistry, Physics +16