Publication | Closed Access
Mechanics of wrinkling of a thin film bonded to a compliant substrate under the influence of spatial thermal modulation
13
Citations
16
References
2015
Year
Materials ScienceEngineeringMechanical BehaviorMechanical EngineeringApplied PhysicsSurface TensionSolid MechanicsCompliant SubstrateThin FilmsSoft MatterElectronic PackagingSpatial Thermal ModulationPhotoelasticityMechanics Of MaterialsThin Film Processing
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