Strategies for wafer-scale hot embossing lithography

Abstract

We summarize flow and filling effects detected during hot embossing lithography (HEL), which reflect the visco-elastic properties of the polymers as well as the specific processing conditions and stamp pattern configurations. In particular a delayed elastic recovery is reported, which is found in larger elevated stamp regions. The consequences of these effects for mask definition by HEL are discussed, and strategies for wafer-scale imprint are de-duced. Successful imprint of 4' wafer is demonstrated under adequate processing conditions.