Concepedia

An Investigation into Zinc Diffusion and Tin Whisker Growth for Electroplated Tin Deposits on Brass

Mark Ashworth, G.D. Wilcox, R.L. Higginson, Richard J. Heath, Changqing Liu

Journal of Electronic Materials · 2014 · 14 citations · 10 references

DOIFull text

Open access

Concepts

References

10

Auger and direct electron spectra in X-ray photoelectron studies of zinc, zinc oxide, gallium and gallium oxide

Gunnar Schön · Journal of Electron Spectroscopy and Related Phenomena · 1973 · 333 citations

, , +10

Statistical analysis of tin whisker growth

Tong Fang, Michael Osterman, Michael Pecht · Microelectronics Reliability · 2005 · 56 citations

, , +1

Minimization of tin whisker formation for lead‐free electronics finishing

R. Schetty · Circuit World · 2001 · 48 citations

, , +11

Effects of Diffusion from Brass Substrates into Electrodeposited Tin Coatings on Corrosion Resistance and Whisker Growth

S. C. Britton, M. Clarke · Transactions of the IMF · 1963 · 40 citations

, , +17

Evaluation of pure tin plated copper alloy substrates for tin whiskers

Sony Mathew, Michael Osterman, Michael Pecht et al. · Circuit World · 2009 · 27 citations

, , +14