Concepedia

The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

Limeng Yin, Song Wei, Zhangliang Xu, Yanfei Geng

Journal of Materials Science Materials in Electronics · 2012 · 24 citations · 15 references

DOI

Concepts

References

15

Creep in metallic materials

J. Čadek · Materials science monographs · 1988 · 579 citations

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 234 citations

, , +13

Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales

Matthew Kerr, Nikhilesh Chawla · Acta Materialia · 2004 · 214 citations

, , +8

The creep properties of lead-free solder joints

Hongxin Song, J. W. Morris, F. Hua · JOM · 2002 · 100 citations

, , +7

Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints

Limeng Yin, X.P. Zhang, Chunsheng Lu · Journal of Electronic Materials · 2009 · 71 citations

, , +4