NiCuP and NiCoP as a diffusion barrier between an Al pad and a solder bump

Diffusion barriers in thin films

M.−A. Nicolet · Thin Solid Films · 1978 · 684 citations

Natural Sciences, Materials Engineering, Materials Science +10

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

The Structure and Mechanical Properties of Electroless Nickel

Arthur H. Graham, Robert W. Lindsay, Harold J. Read · Journal of The Electrochemical Society · 1965 · 187 citations

Natural Sciences, Materials Engineering, Materials Science +14

Structure of Chemically Deposited Nickel

A.W. Goldenstein, W. Rostoker, F. Schoßberger et al. · Journal of The Electrochemical Society · 1957 · 152 citations

Natural Sciences, Materials Engineering, Materials Science +11

The surface of copper-nickel alloy films *1I. Work function and phase composition

W. M. H. Sachtler · Journal of Catalysis · 1965 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +16