Concepedia
Microelectronics Reliability · 2007 · 32 citations · 20 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMaterials ProcessingMetallurgyAlloysMetalsSolderabilitySoldering
20
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations
Engineering, Materials Engineering, Materials Science +15
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 325 citations
Natural Sciences, Materials Engineering, Materials Science +13
Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems
S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations
Natural Sciences, Materials Engineering, Materials Science +16
Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
Iver E. Anderson, J. C. Foley, B. A. Cook et al. · Journal of Electronic Materials · 2001 · 213 citations
Natural Sciences, Materials Engineering, Materials Science +14
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
S. K. Kang, Paul Lauro, Da‐Yuan Shih et al. · IBM Journal of Research and Development · 2005 · 149 citations