The influence of solder volume and pad area on Sn–3.8Ag–0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging - Concepedia

Concepedia

Publication | Closed Access

The influence of solder volume and pad area on Sn–3.8Ag–0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging

32

Citations

20

References

2007

Year

C.K. Wong, J.H.L. Pang, J.W.R. Tew, B. K. Lok, Haoran Lu, Fern Lan Ng, Yukai Sun

Microelectronics Reliability

Materials ScienceMaterials EngineeringChemical EngineeringEngineeringNi Ubm ReactionCorrosionMetallurgical ProcessPad AreaSolder VolumeMetal Processing

References

	Year	Citations

Page 1