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Effects of various metal seed layers on the surface morphology and structural composition of the electroplated copper layer

Tae‐Gyu Woo, Il‐Song Park, Kyeong-Won Seol

Metals and Materials International · 2009 · 18 citations · 4 references

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4

The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment

Chih-Hao Yang, Shih-Chin Lee, Junming Wu et al. · Applied Surface Science · 2005 · 66 citations

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Diffusion and adhesion properties of Cu films on polyimide substrates

Tongxiang Liang, Y.Q. Liu, Zhongwang Fu et al. · Thin Solid Films · 2004 · 29 citations

, , +16

Nucleation and initial growth of copper electrodeposits under galvanostatic conditions

Pierre Vanden Brande, René Winand · Surface and Coatings Technology · 1992 · 27 citations

, , +13

Effects of N2 plasma treatment of titanium nitride/borophosphosilicate glass patterned substrates on metal organic chemical vapor deposition of copper

Young Seok Kim, Donggeun Jung, Suk‐Ki Min · Thin Solid Films · 1999 · 12 citations

, , +10