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Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Materials ScienceMaterials EngineeringElectrical EngineeringNi–sn Intermetallic CompoundsEngineeringElectromigration TechniqueApplied PhysicsMetallurgical InteractionElectronic Packaging