Ta/SiCN bilayer barrier for Cu–ultra low k integration - Concepedia

Concepedia

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Ta/SiCN bilayer barrier for Cu–ultra low k integration

14

Citations

7

References

2005

Year

D.H. Zhang, Liping Yang, C.Y. Li, Ping Lu, P.D. Foo

Thin Solid Films

Materials ScienceEngineeringTa/sicn Bilayer BarrierApplied PhysicsSemiconductor MaterialLayered Material

References

	Year	Citations

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