Applied Physics Letters · 2006 · 105 citations · 11 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials ChemistrySurface ChemistrySurface ScienceChemical CleaningEtching ProcessesSurface CleaningSurface ModificationSurface PhysicsSurface RoughnessAtomic Force Microscopy AnalysisAtomic Force Microscopy RoughnessChemical EtchingEtch ChemistryEtch MechanismsSurface EtchingSurface TerminationWet Chemical Etching
Oxide removal from Ge(100) surfaces treated by HCl and HF solutions with different concentrations are systematically studied by synchrotron radiation photoelectron spectroscopy (SR-PES). SR-PES results show that clean surfaces without any oxide can be obtained after wet chemical cleaning followed by vacuum annealing with a residual carbon contamination of less than 0.02 monolayer. HF etching leads to a hydrogen-terminated Ge surface whose hydrogen coverage is a function of the HF concentration. In contrast, HCl etching yields a chlorine-terminated surface. Possible etching mechanisms are discussed. Surface roughness after HF and HCl treatments is also investigated by atomic force microscopy which shows that HF treatment leaves a rougher surface than HCl.
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Ideal hydrogen termination of the Si (111) surface
G. S. Higashi, Yves J. Chabal, Gary W. Trucks et al. · Applied Physics Letters · 1990 · 1.4K citations