Publication | Closed Access
Effect of interphase boundaries on resistivity and thermopower of nanocrystalline Re-Si thin film composites
22
Citations
8
References
1998
Year
EngineeringThin Film Process TechnologyInterphase BoundariesSilicon On InsulatorSemiconductor NanostructuresSemiconductorsThin Film ProcessingMaterials ScienceElectrical EngineeringNanotechnologySemiconductor MaterialPhase FormationNanocrystalline MaterialElectronic MaterialsNanomaterialsApplied PhysicsDifferent StagesThin FilmsAmorphous SolidElectrical Resistivity
The phase formation, electrical resistivity, and thermoelectric power of the thin film Re-Si composites have been investigated at different stages of the transformation from the amorphous to nanocrystalline state. The nanocrystallization was achieved by the annealing of amorphous films with the initial composition ${\mathrm{Re}}_{0.34}{\mathrm{Si}}_{0.66},$ which is equal to the composition of the crystalline ${\mathrm{ReSi}}_{2}$ semiconductor. The composite films include only two phases: the amorphous phase and the nanocrystalline ${\mathrm{ReSi}}_{2}$ with the mean grain size of about 10 nm; however, a large volume fraction of the composite films is occupied by interfaces and intergrain regions. The transport properties of this semiconductor-semiconductor system show nonmonotonic dependence on the volume fraction of the nanocrystalline phase. The role of the interfaces in this peculiar behavior is discussed.
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