The Journal of the Acoustical Society of America · 1993 · 76 citations · 0 references
EngineeringMechanical EngineeringPhysicsAcousticsHeat TransferThermal AnalysisPhysical AcousticsThermal Boundary LayersThermal DiffusivityPin Fin ArraysPin PlacementThermoacousticsThermofluidics
A new thermoacoustic stack geometry, the pin array, is described. Analytical expressions for velocity and temperature in the pin array are derived, and potential advantages of the pin stack are demonstrated.